3 Odisha-Made Semiconductor Chips Unveiled At Semicon India 2025

Newdelhi:2/9/25: Union Minister for Electronics and Information Technology, Ashwini Vaishnaw, presented three semiconductor chips manufactured in Odisha to Prime Minister Narendra Modi during the inauguration of Semicon India 2025, held in New Delhi on Tuesday.

Among the chips, two ‘Made in India’ semiconductor components were designed by the National Institute of Technology (NIT), Rourkela, while the third was developed by Parala Maharaja Engineering College, Berhampur. The VG Amplifier and Sensor Circuit (C2S0018) and the Present Encryption Core (C2S0017) were developed by NIT Rourkela, whereas the High Performance Multiplier IC (C2S0061) was created by Parala Maharaja Engineering College.

Addressing the conference, Prime Minister Modi highlighted India’s rising stature in the global semiconductor landscape, emphasising the nation’s readiness to play a critical role in the trillion-dollar chip industry.

“Since 2021, investments totaling $18 billion have been approved across 10 semiconductor projects. The world trusts India, believes in India, and is prepared to build the semiconductor future with India,” the Prime Minister said. He underlined that while the previous century was shaped by oil, the future will be defined by semiconductor chips.

PM Modi also noted the rapid growth of the global semiconductor market, which has already reached a valuation of $600 billion and is expected to surpass the $1 trillion mark soon, with India positioned as a significant player in this expanding sector.

Union Minister Ashwini Vaishnaw took to the social media platform X to celebrate the milestone, stating, “From 7.8% GDP growth to a growing semiconductor ecosystem with the first ‘Made in India’ chips — Bharat stands as a lighthouse of stability.”

Chief Minister Mohan Charan Majhi also congratulated Parala Maharaja Engineering College for its contribution. “I warmly congratulate PMEC Berhampur for developing the High Performance Multiplier IC C2S0061 — a proud part of this achievement,” CM Majhi said.

He also inaugurated the Odisha Pavilion at the event, highlighting the state’s potential as a forthcoming hub for semiconductor and electronics innovation, supported by progressive policies and investment-ready infrastructure.

Deputy Chief Minister Kanak Vardhan Singh Deo, in a post on X, described the event as “a defining moment in India’s technological renaissance.” He praised the unveiling of the nation’s first fully indigenous semiconductor chip, the Vikram processor, calling it a significant leap toward strategic autonomy and economic resilience.

Singh Deo emphasised that this milestone reduces India’s import dependency and strengthens domestic manufacturing capabilities, paving the way for the country to become a global hub for electronics and advanced technology.

The three-day Semicon India 2025 conference, themed “Building the Next Semiconductor Powerhouse,” is underway at Yashobhoomi, New Delhi, from September 2 to 4. The event is jointly organised by the India Semiconductor Mission (ISM), under the Ministry of Electronics and Information Technology (MeitY), and SEMI, the global semiconductor industry association.